Chosen Solution
Xiaomi mi9 found out there is not any UV glue on SOC and memory component. I watched lots of teardown video for other phones, its like 99% will use UV glue to protect the SOC, But Xiaomi official claim its not necessary. So I want to find out it’s true or not. thx
The pro’s and con’s of using underfill is complex. It’s used to offer additional support for larger components on devices that tend to flex like cellphones. More makers are using it to help reduce product failure. It also helps prevent wicking of liquids under the chip so in a way it offers a bit of protection. The bad part of underfill is it gets in the way of servicing the device as it can make it harder to get to test points and if the component needs replacing it can get in the way. And lastly, the servicer should put it back after the repair. I personally don’t work on Xiaomi devices so I can’t speak for them. Why are you worried?
